MPC7410 datasheet(42/56 Pages) FREESCALE

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MPC7410 RISC Microprocessor Hardware Specifications, Rev. 6.1

Freescale Semiconductor

System Design Information

The COP interface has a standard header for connection to the target system, based on the 0.025" square-post 0.100"

centered header assembly (often called a Berg header). The connector typically has pin 14 removed as a connector

key.

There is no standardized way to number the COP header shown in Figure 25; consequently, many different pin

numbers have been observed from emulator vendors. Some are numbered top-to-bottom then left-to-right, while

others use left-to-right then top-to-bottom, while still others number the pins counter clockwise from pin 1 (as with

an IC). Regardless of the numbering, the signal placement recommended in Figure 25 is common to all known

emulators.

The QACK signal shown in Figure 25 is usually connected to the PCI bridge chip in a system and is an input to the

MPC7410 informing it that it can go into the quiescent state. Under normal operation this occurs during a low-power

mode selection. In order for COP to work, the MPC7410 must see this signal asserted (pulled down). While shown

on the COP header, not all emulator products drive this signal. If the product does not, a pull-down resistor can be

populated to assert this signal. Additionally, some emulator products implement open-drain type outputs and can

only drive QACK asserted; for these tools, a pull-up resistor can be implemented to ensure this signal is negated

when it is not being driven by the tool. Note that the pull-up and pull-down resistors on the QACK signal are

mutually exclusive and it is never necessary to populate both in a system. To preserve correct power-down operation,

QACK should be merged via logic so that it also can be driven by the PCI bridge.

8.8 Thermal Management Information

This section provides thermal management information for the MPC7410 for air-cooled applications. Proper

thermal control design is primarily dependent on the system-level design—the heat sink, airflow, and thermal

interface material. To reduce the die-junction temperature, heat sinks may be attached to the package by several

methods such as spring clip to holes in the printed circuit board or with screws and springs to the printed circuit

board; see Figure 26 for the BGA package and Figure 27 for the LGA package. This spring force should not exceed

5.5 pounds of force. Note that care should be taken to avoid focused forces being applied to die corners and/or edges

when mounting heat sinks.

Figure 26. BGA Package Exploded Cross-Sectional View with Heat Sink Clip to PCB Option

Thermal Interface Material

Heat Sink

BGA Package

Heat Sink

Clip

Printed-Circuit Board

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