MPC7410 datasheet(10/56 Pages) FREESCALE

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MPC7410 RISC Microprocessor Hardware Specifications, Rev. 6.1

Freescale Semiconductor

Electrical and Thermal Characteristics

Table 4 provides the package thermal characteristics for the MPC7410.

Table 3. Recommended Operating Conditions 1

Characteristic

Symbol

Recommended

Value

Unit

Notes

Core supply voltage

VDD

1.8 V ± 100 mV

—

PLL supply voltage

AVDD

1.8 V ± 100 mV

—

L2 DLL supply voltage

L2AVDD

1.8 V ± 100 mV

—

Processor bus supply

voltage

BVSEL = 0

OVDD

1.8 V ± 100 mV

—

BVSEL = HRESET

OVDD

2.5 V ± 100 mV

—

BVSEL = ¬HRESET or

BVSEL = 1

OVDD

3.3 V ± 165 mV

2, 3

L2 bus supply voltage

L2VSEL = 0

L2OVDD

1.8 V ± 100 mV

—

L2VSEL = HRESET or

L2VSEL = 1

L2OVDD

2.5 V ± 100 mV

—

Input voltage

Processor bus and

JTAG signals

Vin

GND to OVDD

V—

L2 bus

Vin

GND to L2OVDD

V—

Die-junction temperature

0 to 105

°C

—

Notes:

1. These are the recommended and tested operating conditions. Proper device operation outside of these conditions

is not guaranteed.

2. M

xx7410xxnnnLE (Rev. 1.4) and later only. Previous revisions do not support 3.3 V OVDD and have a

recommended OVDD value of 2.5 V ± 100 mV for BVSEL = 1.

3. M

xx7410xxnnnLE (Rev. 1.4) and later only. Previous revisions do not support BVSEL = ¬HRESET.

Table 4. Package Thermal Characteristics

Characteristic

Symbol

Value

Unit

Notes

MPC7410

CBGA

MPC7410

HCTE

Junction-to-ambient thermal resistance, natural convection,

four-layer (2s2p) board

RθJMA

°C/W

1, 2

Junction-to-ambient thermal resistance, 1m/sec airflow,

four-layer (2s2p) board

RθJMA

°C/W

1, 2

Junction-to-ambient thermal resistance, 2m/sec airflow,

four-layer (2s2p) board

RθJMA

°C/W

1, 2

Junction-to-board thermal resistance

RθJB

911

°C/W

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