MPC7410 datasheet(43/56 Pages) FREESCALE

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MPC7410 RISC Microprocessor Hardware Specifications, Rev. 6.1

Freescale Semiconductor

System Design Information

Figure 27. LGA Package Exploded Cross-Sectional View with Heat Sink Clip to PCB Option

The board designer can choose between several types of heat sinks to place on the MPC7410. There are several

commercially-available heat sinks for the MPC7410 from the following vendors:

Aavid Thermalloy

603-224-9988

70 Commercial Street, Suite 200

Concord, NH 03301

Internet: www.aavidthermalloy.com

Alpha Novatech

408-567-8082

473 Sapena Ct. #12

Santa Clara, CA 95054

Internet: www.alphanovatech.com

The Bergquist Company

800-347-4572

18930 West 78th St.

Chanhassen, MN 55317

Internet: www.bergquistcompany.com

International Electronic Research Corporation (IERC)

818-842-7277

413 North Moss St.

Burbank, CA 91502

Internet: www.ctscorp.com

Wakefield Engineering

603-635-2800

33 Bridge St.

Pelham, NH 03076

Internet: www.wakefield.com

Ultimately, the final selection of an appropriate heat sink depends on many factors, such as thermal performance at

a given air velocity, spatial volume, mass, attachment method, assembly, and cost.

Thermal

Heat Sink

LGA Package

Heat Sink

Clip

Printed-Circuit Board

Interface Material

MPC7410 Arkusz danych(PDF) 43 Page - Freescale Semiconductor, Inc