• North America Tel: 800.366.2266 / Fax: 978.366.2266

• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300

• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298

Visit www.macomtech.com for additional data sheets and product information.

M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make

changes to the product(s) or information contained herein without notice.

1

GaAs SP4T Switch

DC - 4.0 GHz

Rev. V4

MASW4060G

ADVANCED:

Data Sheets contain information regarding a product M/A-COM Technology Solutions

is considering for development. Performance is based on target specifications, simulated results,

and/or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY:

Data Sheets contain information regarding a product M/A-COM Technology

Solutions has under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.

Commitment to produce in volume is not guaranteed.

Features

• Low Insertion Loss, 1.2 dB Typical

• Fast Switching Speed, 4 nS Typical

• Ultra Low DC Power Consumption

• Terminated Option

• RoHS* Compliant

Description

M/A-COM’s MASW4060G is an SPDT absorptive or

reflective GaAs MESFET MMIC. This part combines

small

size,

low

insertion

loss

and

power

consumption with high isolation. Ideal for many

applications and module use. It will function well for

designs below 4.0 GHz.

The MASW4060G is fabricated using a mature 1-

micron gate length GaAs MESFET process. The

process features full chip passivation for increased

performance and reliability.

Bond Pad Dimensions

Pad Layout

Parameter

Absolute Maximum

Control Value (A or B)

-8.5 Vdc

Storage Temperature

-65°C to +175°C

Max Operating Temperature

+175°C

Max Input RF Power

+34 dBm

2. Exceeding any one or combination of these limits may cause

permanent damage to this device.

3. M/A-COM does not recommend sustained operation near

these survivability limits.

RF

0.005 x 0.005 (0.125 x 0.125)

RF1, RF2, RF3, RF4

0.004 x 0.004 (0.100 x 0.100)

A1, A2, A3, A4

0.004 x 0.004 (0.100 x 0.100)

B1, B2, B3, B4

0.004 x 0.004 (0.100 x 0.100)

Bond Pad

Dimensions - Inches (mm)

0.008 x 0.004 (0.200 x 0.100)

0.006 x 0.005 (0.150 x 0.125)

Die Size - Inches (mm)

0.076 x 0.058 x 0.010 (1.920 x 1.470 x 0.25)

4. “G” pads designate internal grounds necessary to maintain

data sheet isolation. These are not DC blocked and would

need to be blocked if positive control voltage is required.

5. “T” pads denote a 50 Ω termination path connected to each

RFx port. If bonded to ground, it will cause the related port to

be absorptive, or matched, in the isolated condition. As de-

scribed in note 4, these pads are also not DC blocked.

Ordering Information

Part Number

Package

MASW4060G

1. Die quantity varies.

Schematic

* Restrictions on Hazardous Substances, European Union

Directive 2002/95/EC.

Absolute Maximum Rating

2,3