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Visit www.macomtech.com for additional data sheets and product information.

M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make

changes to the product(s) or information contained herein without notice.

2

GaAs SP4T Switch

DC - 4.0 GHz

Rev. V4

MASW4060G

ADVANCED:

Data Sheets contain information regarding a product M/A-COM Technology Solutions

is considering for development. Performance is based on target specifications, simulated results,

and/or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY:

Data Sheets contain information regarding a product M/A-COM Technology

Solutions has under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.

Commitment to produce in volume is not guaranteed.

Electrical Specifications: 0/-5 Vdc, 50

Parameter

Test Conditions

Units

Min.

Typ.

Max.

Insertion Loss

DC - 0.5 GHz

DC - 1.0 GHz

DC - 2.0 GHz

DC - 4.0 GHz

dB

dB

dB

dB

—

—

—

—

—

—

—

—

1.3

1.3

1.3

1.7

Isolation

DC - 0.5 GHz

DC - 1.0 GHz

DC - 2.0 GHz

DC - 4.0 GHz

dB

dB

dB

dB

50

45

40

30

—

—

—

—

—

—

—

—

VSWR

DC - 0.5 GHz

DC - 1.0 GHz

DC - 2.0 GHz

DC - 4.0 GHz

Ratio

Ratio

Ratio

Ratio

—

—

—

—

—

—

—

—

1.4:1

1.4:1

1.5:1

2.0:1

Input P-1dB

0.5 GHz

0.5 - 4.0 GHz

dBm

dBm

—

—

+17

+27

—

—

IP2

Two Tone Input Power up to +5 dBm

0.5 GHz

0.5 - 4.0 GHz

dBm

dBm

—

—

+45

+60

—

—

IP3

Two Tone Input Power up to +5 dBm

0.5 GHz

0.5 - 4.0 GHz

dBm

dBm

—

—

+35

+46

—

—

Control Current

µA

µA

—

—

—

50

25

200

T-rise, T-fall

10% to 90% RF and 90% to 10% RF

nS

—

2

—

50% control to 90% RF, and 50% control to 10% RF

nS

—

4

—

Transients

In Band

mV

—

20

—

Truth Table

7

A1 B1 A2 B2 A3 B3 A4 B4

ANT-

RF1

ANT-

RF2

ANT-

RF3

ANT-

RF4

1

0

0

1

0

1

0

1

On

Off

Off

Off

0

1

1

0

0

1

0

1

Off

On

Off

Off

0

1

0

1

1

0

0

1

Off

Off

On

Off

0

1

0

1

0

1

1

0

Off

Off

Off

On

7. 0 = 0 V to –0.2 V, 1 = -5 V.

Handling Procedures

Please observe the following precautions to avoid

damage:

Static Sensitivity

Gallium Arsenide Integrated Circuits are sensitive

to electrostatic discharge (ESD) and can be

damaged by static electricity. Proper ESD control

techniques should be used when handling these

devices.

6. Loss changes ±0.0025 dB/°C. (From -55°C to +85°C)

Wire Bonding

A. Ball or wedge with 1.0 mil diameter pure gold

wire. Thermosonic wirebonding with a nominal

stage temperature of 150°C and a ball bonding

force of 40 to 50 grams or wedge bonding force

of 18 to 22 grams is recommended. Ultrasonic

energy and time should be adjusted to the

minimum levels achieve reliable wirebonds.

B. Wirebonds should be started on the chip and

terminated on the package.

GND bonds

should be as short as possible; at least three

and no more than four bond wires from ground

pads to package are recommended.