• North America Tel: 800.366.2266 / Fax: 978.366.2266

• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300

• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298

Visit www.macomtech.com for additional data sheets and product information.

M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make

changes to the product(s) or information contained herein without notice.

3

GaAs SP4T Switch

DC - 4.0 GHz

Rev. V4

MASW4060G

ADVANCED:

Data Sheets contain information regarding a product M/A-COM Technology Solutions

is considering for development. Performance is based on target specifications, simulated results,

and/or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY:

Data Sheets contain information regarding a product M/A-COM Technology

Solutions has under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.

Commitment to produce in volume is not guaranteed.

Typical Performance @ 25°C

Handling Precautions

Permanent damage to the MASW4060 may occur

if the following precautions are not adhered to:

A. Cleanliness - The MASW4060 should be

handled in a clean environment.

DO NOT

attempt to clean unit after MASW4060 is

installed.

B. Static Sensitivity - All chip handling equipment

and personnel should be DC grounded.

C. Transient - Avoid instrument and power supply

transients while bias is applied to the

MASW4060.

Use shielded signal and bias

cables to minimize inductive pick-up.

D. Bias - Apply voltage to either control port V1 or

V2 only when the other is grounded. No port

should be allowed to “float.”

E. General Handling - It is recommended that the

MASW4060 chip be handled along the long

side of the die with a sharp pair of bent

tweezers. DO NOT touch the surface of the

chip with fingers or tweezers.

01

234

0.0

0.5

1.0

1.5

2.0

Frequency (GHz)

35

40

45

50

55

60

65

012

34

Frequency (GHz)

Mounting

The MASW4060 is back-metallized with Pd/Ni/Au

(100/1,000/10,000Å) metallization. It can be die-

mounted with AuSn eutectic performs or with ther-

mally conductive epoxy.

The package surface

should be clean and flat before attachment.

Eutectic Die Attach:

A. A 80/20 gold/tin perform is recommended with

a work surface temperature or approximately

225°C and a tool temperature of 265°C. When

hot 90/10 nitrogen/hydrogen gas is applied,

tool tip temperature should be approximately

290°C.

B. DO NOT expose the MASW4060 to a tempera-

ture greater than 320°C for more than 20 sec-

onds. No more than 3 seconds of scrubbing

should be required for attachment.

Epoxy Die Attach

:

A. Apply a minimum amount of epoxy and place

the MASW4060 into position. A thin epoxy fillet

should be visible around the perimeter of the

chip.

B. Cure epoxy per manufacturer’s recommended

schedule.

C. Electrically conductive epoxy may be used but

is not required.

1.0

1.1

1.2

1.3

1.4

0123

4

Frequency (GHz)

Insertion Loss

Isolation

VSWR