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STM32F051R6 Arkusz danych(PDF) 98 Page - STMicroelectronics |
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STM32F051R6 Arkusz danych(HTML) 98 Page - STMicroelectronics |
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98 / 104 page ![]() STM32F051x Package characteristics Doc ID 022265 Rev 3 99/105 Figure 37. UFQFPN32 - 32-lead ultra thin fine pitch quad flat no-lead package outline (5 x 5) 1. Drawing is not to scale. 2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life. 3. There is an exposed die pad on the underside of the UFQFPN package. This pad is used for the device ground and must be connected. It is referred to as pin 0 in Table 13: Pin definitions. Seating plane ddd C C A3 A1 A D e 9 16 17 24 32 Pin # 1 ID R = 0.30 8 E L L D2 1 b E2 A0B8_ME Bottom view Table 71. UFQFPN32 - 32-lead ultra thin fine pitch quad flat no-lead package (5 x 5), package mechanical data Dim. mm inches(1) Min Typ Max Min Typ Max A 0.5 0.55 0.6 0.0197 0.0217 0.0236 A1 0.00 0.02 0.05 0 0.0008 0.0020 A3 0.152 0.006 b 0.18 0.23 0.28 0.0071 0.0091 0.0110 D 4.90 5.00 5.10 0.1929 0.1969 0.2008 D2 3.50 0.1378 E 4.90 5.00 5.10 0.1929 0.1969 0.2008 E2 3.40 3.50 3.60 0.1339 0.1378 0.1417 e 0.500 0.0197 L 0.30 0.40 0.50 0.0118 0.0157 0.0197 ddd 0.08 0.0031 1. Values in inches are converted from mm and rounded to 4 decimal digits. |
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