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AN2036 - APPLICATION NOTE

DIP AND LOOK TEST

After appropriate ageing, the connections are dipped inside a non-activated flux, then into molten solder.

Then, after cooling and optional cleaning in alcohol, the connections are inspected to verify the critical

area (the one that is to be soldered to the board) of the connection surfaces is covered by fresh solder

(Figure 1.). The test is considered passed if 95% of the surface is covered with fresh solder.

Figure 1. Terminals after Dip and Look Test

The mechanism for forming the solder joint depends on the coating and solder compositions as well as on

the test conditions (as listed in Table 2.).