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AN2036 - APPLICATION NOTE

Table 2. Test Conditions

Note: Non activated flux to be 25% by weight of colophany diluted in isopropanol as per IPC J-STD004.

Surface Mount

Devices

–

8 hours steam ageing or ageing in humidity chamber at 85°C and 85%rH (Humidity

chamber used for pre-plated components)

–

Dry ageing at 150°C: 8 hours for NiPdAu Pre-plated units and 16 hours for solder coated

units (Ageing is non cumulative = to be done on different samples)

Lead-free

Solder

Sn-Ag-Cu melted at 245°C

Flux dipping

5 to 10 seconds

Solder dipping

5 seconds ±0.5s for Tin

based connection coatings

10 seconds ±0.5 s for Pre-

plated NiPd(Au) connections

Leaded Solder

Sn-Pb melted at 220°C

Flux dipping

5 to 10 seconds

Solder dipping

5 seconds ±0.5s for Tin

based connection coatings

10 seconds ±0.5s for Pre-

plated NiPd(Au) connections

Solder Wave Resistance to Dissolution

Device that can be soldered by wave soldering

Sn-Pb or Sn-Ag-Cu melted at 260°C

Flux dipping

5 to 10 seconds

Solder dipping

10 seconds ±0.5s

Insertion Packages or

Through Hole

Devices

8 hours steam ageing or ageing in humidity chamber at 85°C and 85%rH

Lead-free Solder

Sn-Ag-Cu melted at 245°C

Flux dipping

5 to 10 seconds

Solder dipping

5 seconds ±1s

Leaded Solder

Sn-Pb melted at 245°C

Flux dipping

5 to 10 seconds

Solder dipping

5 seconds ±1s