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AN2036 Arkusz danych(PDF) 4 Page - STMicroelectronics |
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AN2036 Arkusz danych(HTML) 4 Page - STMicroelectronics |
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4 / 7 page ![]() 4/7 AN2036 - APPLICATION NOTE WETTING BALANCE TEST Connections are dipped inside a non-activated flux. Then the package is loaded on the wetting balance arm, and the connections are dipped into a molten solder. The force exerted on the balance arm is plotted as a function of time. This test cannot be applied for all the packages. It can, though, be adjusted to fit special cases. Typical forces versus time curves are shown in Figure 2. Figure 2. Wetting Force Plotted against Time, for Three Cases The shape of the curves can be explained as follows: – At the beginning, the buoyancy forces (due to the interfacial tension) are predominant, and so the wetting force is negative. – Gradually, the solder begins to wet the terminals, and the wetting force increases with time, overcoming the buoyancy force. – Eventually, it reaches a flat (plateau) zone. No Forced Ageing Ageing: 16 hours, 150°C Ageing: 8 hours, 85°C and 85% Humidity Immersion: 10 seconds |
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