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ADL5246ACPZN-R7 Arkusz danych(PDF) 33 Page - Analog Devices

Numer części ADL5246ACPZN-R7
Szczegółowy opis  3 GHz Variable Gain LNA with Integrated 쩍 W Driver Amplifier
PDF  36 Pages
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Producent  AD [Analog Devices]
Strona internetowa  http://www.analog.com
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ADL5246ACPZN-R7 Arkusz danych(HTML) 33 Page - Analog Devices

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Data Sheet
ADL5246
Rev. A | Page 33 of 36
CHARACTERIZATION INFORMATION
The ADL5246 was characterized with multiple samples obtained
from three batch lots. Each ADL5246 was attached to its own
circuit board that was dedicated and tuned to one of the AMP3
frequency bands. This created a body of boards dedicated to
each band. AMP1 and AMP2 operate over a broad frequency
range and do not require tuning. Aggregating boards with their
AMP3 tuned to the various bands increased the sample size for
the characterization of AMP1 and AMP2.
Characterization measurements employed an Agilent Technologies
PNA-X vector network analyzer, scalar rack and stack equipment,
a noise figure analyzer, and temperature forcing equipment, all
under software control.
The typical performance figures represent one typical ADL5246
with performance near the median of a body of available samples.
A typical example ADL5246 was selected to represent AMP1
and a different ADL5246 was selected to represent AMP2. Separate
examples are used for each of the AMP3 bands; therefore, the
AMP3 plots do not show the same ADL5246 board retuned to
each band.
The plots show the performance obtained by the typical
ADL5246 chosen to demonstrate each amplifier, rather than
showing the numerical median of all the samples measured for
any one parameter.
The circuit boards used for device characterization are fabricated
with Isola FR408, which offers a low coefficient of thermal
expansion (CTE) and lower attenuation than standard FR4 without
the fragility of Rogers materials.
All three amplifiers are powered on even when not directly in
use and this made heat a concern when testing in a high
temperature environment. Two 10 mm × 10 mm heat sinks are
attached to the back of the circuit board with Arctic Silver thermal
adhesive. This lowered the θJA at the top of the package from
16.5°C/W without the heat sink to 12.5°C/W with one, making
operating AMP3 at P1dB output power levels in a 105°C ambient
temperature possible without reaching the maximum junction
temperature of the ADL5246.



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