LSM6DSM datasheet(15/113 Pages) STMICROELECTRONICS

15 / 113 page

DocID028165 Rev 2

15/113

LSM6DSM

Overview

113

Overview

The LSM6DSM is a system-in-package featuring a high-performance 3-axis digital

accelerometer and 3-axis digital gyroscope.

The integrated power-efficient modes are able to reduce the power consumption down to

0.65 mA in high-performance mode, combining always-on low-power features with superior

sensing precision for an optimal motion experience for the consumer thanks to ultra-low

noise performance for both the gyroscope and accelerometer.

The LSM6DSM delivers best-in-class motion sensing that can detect orientation and

gestures in order to empower application developers and consumers with features and

capabilities that are more sophisticated than simply orienting their devices to portrait and

landscape mode.

The event-detection interrupts enable efficient and reliable motion tracking and contextual

awareness, implementing hardware recognition of free-fall events, 6D orientation, click and

double-click sensing, activity or inactivity, and wakeup events.

The LSM6DSM supports main OS requirements, offering real, virtual and batch mode

sensors. In addition, the LSM6DSM can efficiently run the sensor-related features specified

in Android, saving power and enabling faster reaction time. In particular, the LSM6DSM has

been designed to implement hardware features such as significant motion, tilt, pedometer

functions, timestamping and to support the data acquisition of an external magnetometer

with ironing correction (hard, soft).

The LSM6DSM offers hardware flexibility to connect the pins with different mode

connections to external sensors to expand functionalities such as adding a sensor hub,

auxiliary SPI, etc.

Up to 4 kbyte of FIFO with dynamic allocation of significant data (i.e. external sensors,

timestamp, etc.) allows overall power saving of the system.

The LSM6DSM gyroscope fully supports OIS/EIS applications. The module can output OIS

data through a dedicated auxiliary SPI and includes a dedicated configurable signal

processing path for OIS. OIS data can be sent directly to the application processor for data

processing. The gyroscope UI signal processing path is completely independent from that of

the OIS and is readable through FIFO.

Like the entire portfolio of MEMS sensor modules, the LSM6DSM leverages the robust and

mature in-house manufacturing processes already used for the production of

micromachined accelerometers and gyroscopes. The various sensing elements are

manufactured using specialized micromachining processes, while the IC interfaces are

developed using CMOS technology that allows the design of a dedicated circuit which is

trimmed to better match the characteristics of the sensing element.

The LSM6DSM is available in a small plastic land grid array (LGA) package of

2.5 x 3.0 x 0.83 mm to address ultra-compact solutions.

LSM6DSM Arkusz danych(PDF) 15 Page - STMicroelectronics

LSM6DSM Arkusz danych(HTML) 15 Page - STMicroelectronics

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 ...More

Arkusz danych Pobierz

Link URL