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LMP8601, LMP8601-Q1

LMP8602, LMP8602-Q1

LMP8603, LMP8603-Q1

SNOSAR2H – SEPTEMBER 2008 – REVISED APRIL 2016

www.ti.com

Product Folder Links: LMP8601 LMP8601-Q1 LMP8602 LMP8602-Q1 LMP8603 LMP8603-Q1

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Copyright © 2008–2016, Texas Instruments Incorporated

11 Device and Documentation Support

11.1 Device Support

11.1.1 Development Support

LMP8601 TINA SPICE Model, SNOM084

TINA-TI SPICE-Based Analog Simulation Program, http://www.ti.com/tool/tina-ti

11.2 Related Links

Table 1 lists quick access links. Categories include technical documents, support and community resources,

tools and software, and quick access to sample or buy.

Table 1. Related Links

PARTS

PRODUCT FOLDER

SAMPLE & BUY

TECHNICAL

DOCUMENTS

TOOLS &

SOFTWARE

SUPPORT &

COMMUNITY

LMP8601

Click here

Click here

Click here

Click here

Click here

LMP8601-Q1

Click here

Click here

Click here

Click here

Click here

LMP8602

Click here

Click here

Click here

Click here

Click here

LMP8602-Q1

Click here

Click here

Click here

Click here

Click here

LMP8603

Click here

Click here

Click here

Click here

Click here

LMP8603-Q1

Click here

Click here

Click here

Click here

Click here

11.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective

contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of

Use.

TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration

among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help

solve problems with fellow engineers.

Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and

contact information for technical support.

11.4 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

11.5 Electrostatic Discharge Caution

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

11.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.