LMP8602MASLASHNOPB datasheet(4/42 Pages) TI1

4 / 42 page

LMP8601, LMP8601-Q1

LMP8602, LMP8602-Q1

LMP8603, LMP8603-Q1

SNOSAR2H – SEPTEMBER 2008 – REVISED APRIL 2016

www.ti.com

Product Folder Links: LMP8601 LMP8601-Q1 LMP8602 LMP8602-Q1 LMP8603 LMP8603-Q1

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(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

The maximum power dissipation must be derated at elevated temperatures and is dictated by TJ(MAX), RθJA, and the ambient

temperature, TA. The maximum allowable power dissipation PDMAX = (TJ(MAX) – TA) / RθJA or the number given in Absolute Maximum

Ratings, whichever is lower.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply voltage (VS – GND)

–0.3

Continuous input voltage (–IN and +IN)

–22

Transient (400 ms)

–25

Maximum voltage at A1, A2, OFFSET and OUT pins

VS + 0.3

GND – 0.3

Operating temperature, TA

LMP8601EDRQ1 only

–40

150

°C

All other devices

–40

125

Junction temperature(2)

–40

150

°C

Mounting temperature

Infrared or convection (20 sec)

235

°C

Wave soldering lead (10 sec)

260

Storage temperature, Tstg

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings: LMP860x

VALUE

UNIT

V(ESD)

Electrostatic

discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

All pins except 1 and 8

±2000

Pins 1 and 8

±4000

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±1000

Machine model

±200

(1)

AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.3 ESD Ratings: LMP860x-Q1

VALUE

UNIT

V(ESD)

Electrostatic

discharge

Human body model (HBM), per AEC Q100-002(1)

All pins except 1 and 8

±2000

Pins 1 and 8

±4000

Charged-device model (CDM), per AEC Q100-011

±1000

Machine model

±200

(1)

The maximum power dissipation must be derated at elevated temperatures and is dictated by TJ(MAX), RθJA, and the ambient

temperature, TA. The maximum allowable power dissipation PDMAX = (TJ(MAX) – TA) / RθJA or the number given in Absolute Maximum

Ratings, whichever is lower.

6.4 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Supply voltage (VS – GND)

5.5

OFFSET voltage (Pin 7)

Operating temperature, TA

(1)

LMP8601EDRQ1 only

–40

150

°C

All other devices

–40

125

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