LPC802 datasheet(68/83 Pages) NXP

68 / 83 page

LPC802

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Product data sheet

Rev. 1.6 — 27 April 2018

68 of 83

NXP Semiconductors

LPC802

32-bit ARM Cortex-M0+ microcontroller

16. Package outline

Fig 35. Package outline SOT360-1 (TSSOP20)

UNIT

cD (1)

E (2)

(1)

eHE

LLp

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

0.15

0.05

0.95

0.80

0.30

0.19

0.2

0.1

6.6

6.4

4.5

4.3

0.65

6.6

6.2

0.4

0.3

0.5

0.2

0.13

0.1

0.2

DIMENSIONS (mm are the original dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.

0.75

0.50

SOT360-1

MO-153

99-12-27

03-02-19

w M

b p

0.25

110

pin 1 index

L p

detail X

(A )

v M A

2.5

5 mm

scale

TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm

SOT360-1

max.

1.1

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