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MPC7445 Arkusz danych(PDF) 29 Page - Freescale Semiconductor, Inc |
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MPC7445 Arkusz danych(HTML) 29 Page - Freescale Semiconductor, Inc |
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29 / 64 page ![]() MPC7455 RISC Microprocessor Hardware Specifications, Rev. 4.1 Freescale Semiconductor 29 Electrical and Thermal Characteristics Figure 11 shows the typical connection diagram for the MPC7455 interfaced to PB2 SRAMs, such as the Freescale MCM63R737, or late write SRAMs, such as the Freescale MCM63R836A. Figure 11. Typical Synchronous 1-MByte L3 Cache Late Write or PB2 Interface L3_ADDR[16:0] L3_CNTL[0] SA[16:0] K K SS SW ZZ G SRAM 0 DQ[0:17] DQ[18:36] L3_CNTL[1] GVDD/2 1 GND GND SRAM 1 GVDD/2 1 GND GND {L3_DATA[0:15], {L3_DATA[16:31], {L3_DATA[32:47], L3_CLK[0] L3_CLK[1] L3_ECHO_CLK[0] L3_ECHO_CLK[1] L3_ECHO_CLK[2] {L3_DATA[48:63], L3_DP[0:1]} L3_DP[2:3]} L3_DP[4:5]} L3_DP[6:7]} Denotes Receive (SRAM to MPC7455) Aligned Signals MPC7455 Denotes Transmit (MPC7455 to SRAM) Aligned Signals L3_ECHO_CLK[3] SA[16:0] K K SS SW ZZ G DQ[0:17] DQ[18:36] Note: 1. Or as recommended by SRAM manufacturer for single-ended clocking. |
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