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MPC7445 Arkusz danych(PDF) 33 Page - Freescale Semiconductor, Inc |
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MPC7445 Arkusz danych(HTML) 33 Page - Freescale Semiconductor, Inc |
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33 / 64 page ![]() MPC7455 RISC Microprocessor Hardware Specifications, Rev. 4.1 Freescale Semiconductor 33 Pin Assignments 6 Pin Assignments Figure 18 (in Part A) shows the pinout of the MPC7445, 360 CBGA package as viewed from the top surface. Part B shows the side profile of the CBGA package to indicate the direction of the top surface view. Figure 18. Pinout of the MPC7445, 360 CBGA Package as Viewed from the Top Surface A B C D E F G H J K L M N P R T 12 3 4 5 6 78 910 11 12 13 14 15 16 Not to Scale 17 18 19 U V W Part A View Part B Die Substrate Assembly Encapsulant |
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