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MPC7445 Arkusz danych(PDF) 30 Page - Freescale Semiconductor, Inc |
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MPC7445 Arkusz danych(HTML) 30 Page - Freescale Semiconductor, Inc |
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30 / 64 page ![]() MPC7455 RISC Microprocessor Hardware Specifications, Rev. 4.1 30 Freescale Semiconductor Electrical and Thermal Characteristics Figure 12 shows the L3 bus timing diagrams for the MPC7455 interfaced to PB2 or late write SRAMs. Figure 12. L3 Bus Timing Diagrams for Late Write or PB2 SRAMs 5.2.5 IEEE 1149.1 AC Timing Specifications Table 14 provides the IEEE 1149.1 (JTAG) AC timing specifications as defined in Figure 14 through Figure 17. Table 14. JTAG AC Timing Specifications (Independent of SYSCLK) 1 At recommended operating conditions. See Table 4. Parameter Symbol Min Max Unit Notes TCK frequency of operation fTCLK 0 33.3 MHz TCK cycle time t TCLK 30 — ns TCK clock pulse width measured at 1.4 V tJHJL 15 — ns TCK rise and fall times tJR and tJF 02 ns TRST assert time tTRST 25 — ns 2 Input setup times: Boundary-scan data TMS, TDI tDVJH tIVJH 4 0 — — ns 3 Input hold times: Boundary-scan data TMS, TDI tDXJH tIXJH 20 25 — — ns 3 L3_ECHO_CLK[0,2] L3 Data and Data VM VM = Midpoint Voltage (GVDD/2) tL3DVEH tL3DXEH Parity Inputs L3_CLK[0,1] ADDR, L3_CNTL VM tL3CHOV tL3CHOX VM L3DATA WRITE tL3CHDZ Outputs Inputs L3_ECHO_CLK[1,3] tL3CHDV tL3CHDX tL3CHOZ |
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