Data Sheet

ADRF5160

Rev. 0 | Page 9 of 12

APPLICATIONS INFORMATION

EVALUATION BOARD

The ADRF5160-EVALZ can withstand high power levels and

temperatures at which the device operates.

The ADRF5160-EVALZ evaluation board is constructed with

eight metal layers and dielectrics between each layer, as shown

in Figure 13. Each metal layer has a 1 oz (1.3 mil) copper

thickness, and the external layers are plated to 2 oz.

The top dielectric material is 10 mil Rogers RO4350, which

exhibits a low thermal coefficient, offering control over thermal

rise of the board. The dielectrics between other metal layers are

FR4. The overall board thickness is 62 mil.

W = 18mil

G = 13mil

T = 2.1 mil

H = 10mil

1.5oz Cu (2.1mil)

RO4350 = 10mil

FR4

FR4

FR4

FR4

FR4

FR4

1oz Cu (1.3mil)

1oz Cu (1.3mil)

1oz Cu (1.3mil)

1oz Cu (1.3mil)

1oz Cu (1.3mil)

1oz Cu (1.3mil)

1.5oz Cu (2.1mil)

1.5oz Cu (2.1mil)

1.5oz Cu (2.1mil)

Figure 13. ADRF5160-EVALZ Evaluation Board Cross Sectional View

The top copper layer has all RF and dc traces. The other seven

layers provide sufficient ground and help handle the thermal

rise on the ADRF5160-EVALZ. In addition, via holes are

provided around transmission lines and under the exposed pad

of package, as shown in Figure 15, for proper thermal

grounding. RF transmission lines on the board are of a coplanar

wave guide design with a width of 18 mils and ground spacing

of 13 mils.

To ensure maximum heat dissipation and to reduce thermal rise

on the board, some application considerations are essential. The

evaluation board must be attached to a copper support plate at

the bottom of the board. The ADRF5160-EVALZ comes with

this support plate attachment. Attach this evaluation board with

its support plate to a heat sink using thermal grease during all

high power operations. Figure 14 shows the board temperature

vs. the RF power input tested with the preceding conditions and

precautions (the evaluation board and support plate are attached

to a heat sink). The temperature rise is less than 8°C up to

48 dBm of RF power input, which provides the required

thermal dissipation when operating at high power levels.

RF POWER INPUT (dBm)

43.0

43.5

44.5

45.5

46.5

47.5

36

35

34

33

32

31

30

29

28

27

26

25

44.0

45.0

46.0

47.0

48.0

Figure 14. ADRF5160-EVALZ Evaluation Board Temperature Rise

(Oven Temperature Set to 25°C)

R1

TP2

TP1

TP3

C2

C3

C1

Figure 15. ADRF5160-EVALZ Evaluation Board Layout