| Zakładka z wyszukiwarką danych komponentów |
|
MAX8625 Arkusz danych(PDF) 8 Page - Maxim Integrated Products |
|
|
|||||||||||||||||||||||||||||
MAX8625 Arkusz danych(HTML) 8 Page - Maxim Integrated Products |
|
8 / 16 page ![]() High-Efficiency, Seamless Transition, Step-Up/Down DC-DC Converter 8 _______________________________________________________________________________________ Detailed Description The MAX8625A step-up/down architecture employs a true H-bridge topology that combines a boost converter and a buck converter topology using a single inductor and output capacitor (Figure 1). The MAX8625A utilizes a pulse-width modulated (PWM), current-mode control scheme and operates at a 1MHz fixed frequency to minimize external component size. A proprietary H-bridge design eliminates mode changes when transi- tioning from buck to boost operation. This control scheme provides very low output ripple using a much smaller inductor than a conventional H-bridge, while avoiding glitches that are commonly seen during mode transitions with competing devices. The MAX8625A switches at an internally set frequency of 1MHz, allowing for tiny external components. Internal compensation further reduces the external component count in cost- and space-sensitive applications. The MAX8625A is optimized for use in HDDs, DSCs, and other devices requiring low-quiescent current for opti- mal light-load efficiency and maximum battery life. Control Scheme The MAX8625A basic noninverting step-up/down con- verter operates with four internal switches. The control logic determines which two internal MOSFETs operate to maintain the regulated output voltage. Unlike a tradi- tional H-bridge, the MAX8625A utilizes smaller peak- inductor currents, thus improving efficiency and lowering input/output ripple. The MAX8625A uses three operating phases during each switching cycle. In phase 1 (fast-charge), the inductor current ramps up with a di/dt of VIN/L. In phase 2 (slow charge/discharge), the current either ramps up or down depending on the difference between the input voltage and the output voltage (VIN - VOUT)/L. In phase 3 (discharge), the inductor current discharges at a rate of VOUT/L through MOSFETs P2 and N1 (see Figure 1). An additional fourth phase (phase 4: hold) is entered when the inductor current falls to zero during phase 3. This fourth phase is only used during skip operation. The state machine (Figure 2) decides which phase to use and when to switch phases. The converter goes through the first three phases in the same order at all Pin Description PIN NAME FUNCTION 1, 2 LX1 Inductor Connection 1. Connect the inductor between LX1 and LX2. Both LX1 pins must be connected together externally. LX1 is internally connected to GND during shutdown. 3, 4 LX2 Inductor Connection 2. Connect the inductor between LX1 and LX2. Both LX2 pins must be connected together externally. LX2 is internally connected to GND during shutdown. 5 ON Enable Input. Connect ON to the input or drive high to enable the IC. Drive ON low to disable the IC. 6 SKIP Mode Select Input. Connect SKIP to GND to enable skip mode. This mode provides the best overall efficiency curve. Connect SKIP to IN to enable forced-PWM mode. This mode provides the lowest noise, but reduces light- load efficiency compared to skip mode. 7FB Feedback Input. Connect to ground to set the fixed 3.3V output. Connect FB to the center tap of an external resistor-divider from the output to GND to set the output voltage to a different value. VFB regulates to 1.25V. 8 REF Reference Output. Bypass REF to GND with a 0.1µF ceramic capacitor. VREF is 1.25V and is internally pulled to GND during shutdown. 9, 10 OUT Power Output. Bypass OUT to GND with two 22µF ceramic capacitors. Both OUT pins must be connected together externally. 11, 12 GND Ground. Connect the exposed pad and GND directly under the IC. 13, 14 IN Power-Supply Input. Bypass IN to GND with two 22µF ceramic capacitors. Connect IN to a 2.5V to 5.5V supply. Both IN pins must be connected together externally. —EP Exposed Pad. Connect to GND directly under the IC. Connect to a large ground plane for increased thermal performance. |
|
|
Link URL |
| Czy Alldatasheet okazała się pomocna? [ DONATE ] |
O Alldatasheet | Reklama | Kontakt | Polityka prywatności | Link do karty katalogowej | Linki | Lista producentów All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |