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STM32F732IE Arkusz danych(PDF) 105 Page - STMicroelectronics

Numer części STM32F732IE
Szczegółowy opis  Arm® Cortex®-M7 32b MCUFPU, 462DMIPS, up to 512KB Flash 256164KB RAM, USB OTG HS/FS, 18 TIMs, 3 ADCs, 21 com IF
PDF  226 Pages
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Producent  STMICROELECTRONICS [STMicroelectronics]
Strona internetowa  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32F732IE Arkusz danych(HTML) 105 Page - STMicroelectronics

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DS11854 Rev 6
105/226
STM32F732xx STM32F733xx
Electrical characteristics
198
PD
Power dissipation at TA = 85 °C for
suffix 6 or TA = 105 °C for suffix
7(9)
LQFP64
-
-
881
mW
LQFP100
-
-
1117
WLCSP100
-
-
558
LQFP144
-
-
1587
LQFP176
-
-
1869
UFBGA144
-
-
476
UFBGA176
-
-
485
TA
Ambient temperature for 6 suffix
version
Maximum power dissipation
− 40
-
85
°C
Low power dissipation(10)
− 40
-
105
Ambient temperature for 7 suffix
version
Maximum power dissipation
− 40
-
105
°C
Low power dissipation(10)
− 40
-
125
TJ
Junction temperature range
6 suffix version
− 40
-
105
°C
7 suffix version
− 40
-
125
1. The over-drive mode is not supported at the voltage ranges from 1.7 to 2.1 V.
2. 216 MHz maximum frequency for 6 suffix version (200 MHz maximum frequency for 7 suffix version).
3. VDD/VDDA minimum value of 1.7 V is obtained with the use of an external power supply supervisor (refer to Section 3.15.2:
Internal reset OFF).
4. When the ADC is used, refer to Table 67: ADC characteristics.
5. If VREF+ pin is present, it must respect the following condition: VDDA - VREF+ < 1.2 V.
6. It is recommended to power VDD and VDDA from the same source. A maximum difference of 300 mV between VDD and VDDA
can be tolerated during power-up and power-down operation.
7. The over-drive mode is not supported when the internal regulator is OFF.
8. To sustain a voltage higher than VDD + 0.3, the internal pull-up and pull-Down resistors must be disabled.
9. If TA is lower, higher PD values are allowed as long as TJ does not exceed TJmax.
10. In low power dissipation state, TA can be extended to this range as long as TJ does not exceed TJmax.
Table 16. General operating conditions (continued)
Symbol
Parameter
Conditions(1)
Min
Typ
Max
Unit
Table 17. Limitations depending on the operating power supply range
Operating
power supply
range
ADC operation
Maximum Flash
memory access
frequency with
no wait states
(fFlashmax)
Maximum HCLK
frequency vs Flash
memory wait states
(1)(2)
I/O operation
Possible Flash
memory
operations
VDD =1.7 to
2.1 V(3)
Conversion time
up to 1.2 Msps
20 MHz
180 MHz with 8 wait
states and over-drive
OFF
No I/O
compensation
8-bit erase and
program
operations only
VDD = 2.1 to
2.4 V
Conversion time
up to 1.2 Msps
22 MHz
216 MHz with 9 wait
states and over-drive
ON
No I/O
compensation
16-bit erase and
program
operations



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