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BLUENRG-332VC Arkusz danych(PDF) 53 Page - STMicroelectronics |
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BLUENRG-332VC Arkusz danych(HTML) 53 Page - STMicroelectronics |
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53 / 67 page ![]() 7 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 7.1 VFQFPN32 package information This VFQFPN is a 32 lead, 5 x 5 mm, 0.50 mm pitch, very fine pitch quad flat no lead package. Figure 18. VFQFPN32 - Outline C SEATNG PLANE A3 SIDE VIEW A1 A D E e e b E2 b L L D2 PIN #1 ID CHAMFER 0.35 BOTTOM VIEW 9 17 8 24 25 32 1. Drawing is not to scale. 2. Package outline exclusive of any mold flashes dimensions and metal burrs. 3. Details of terminal 1 are optional but must be located on the top surface of the package by using either a mold or marked features. BlueNRG-LPS Package information DS13819 - Rev 4 page 53/67 |
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