MPC8560CPXAPDB datasheet(103/108 Pages) FREESCALE

103 / 108 page

MPC8560 Integrated Processor Hardware Specifications, Rev. 3.1

Freescale Semiconductor

103

Document Revision History

2.0

Section 1.1—Updated features list to coincide with latest version of the reference manual

Table 1 and Table 2— Addition of CPM to OVDD and OVIN; Addition of SYSCLK to OVIN

Table 2—Addition of notes 1 and 2

Table 3—Addition of note 1

Table 5—New

Section 4—New

Table 12—Addition of IVREF

Table 14—Modified maximum values for tDISKEW

Table 15—Added MSYNC_OUT to tMCKSKEW2

Figure 5—New

Section 6.2.1—Removed Figure 4, "DDR SDRAM Input Timing Diagram"

Section 7.1—Removed refereneces to 2.5 V from first paragraph

Figure 8—New

Table 18 and Table 19—Modified “conditions” for IIH and I IL

Table 20—Addition of min and max for GTX_CLK125 reference clock duty cycle

Table 24—Addition of min and max for GTX_CLK125 reference clock duty cycle

Table 26—Addition of min and max for GTX_CLK125 reference clock duty cycle

Figure 17 and Figure 19—Changed LSYNC_IN to Internal clock at top of each figure

Table 33—Modified values for tFIIVKH, tNIIVKH, and tTDIVKH; addition of tPIIVKH and tPIIXKH.

Table 34—Modified values for tFEKHOX, tNIKHOX,tNEKHOX, tTDKHOX; addition of tPIKHOX.

Figure 23—New

Figure 30—New

Figure 36—New

Figure 38—New

Table 30—Removed row for tLBKHOX3

Table 43—New (AC timing of PCI-X at 66 MHz)

Table 53—Addition of note 19

Figure 60—Addition of jumper and note at top of diagram

Table 55—Changed max bus freq for 667 core to 166

Section 16.2.1—Modified first paragraph

Figure 52—Modified

Figure 53—New

Table 59—Modified thermal resistance data

Section 16.2.4.2—Modified first and second paragraphs

2.1

Section 2.1.2—New

Table 15—Added speed-specifc minimum values for 333, 266, and 200 MHz

Table 30—Replaced all refereneces to TSEC1_TXD[6:5] to TSEC2_TXD[6:5]

Table 30—Added tLBSKEW and note 3

Table 30—Added comment about rev. 2.x devices to note 5

Section 14.1— Changed minium height from 2.22 to 3.07 and maximum from 2.76 to 3.75

Section 16.2.4.1—Changed

JC from 0.3 to 0.8; changed die-junction temperature from 67° to 71°

Section 17.7—Added paragraph that begins “TSEC1_TXD[3:0]...”

Table 61. Document Revision History

Rev. No.

Substantive Change(s)

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