M50FW040 datasheet(52/53 Pages) STMICROELECTRONICS

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Revision history

M50FW040

52/53

Revision history

Table 28.

Document revision history

Date

Version

Changes

September 2000

-01

First Issue

04-Oct-2000

-02

DC Characteristics: ICC4 changed

11-Apr-01

-03

Document type: from Preliminary Data to Data Sheet

Program and Erase functions clarification

Read Electronic Signature table change

FWH Register Configuration Map table change

Input Register Definition table, note clarification

DC Characteristics parameters clarification and new VIH and VIL

parameters added

FWH Interface AC Signal Timing Characteristics change

A/A Mux Interface Read AC Characteristics change

A/A Mux Interface Write AC Characteristics change

A/A Mux Interface Write AC Waveforms change

06-Jul-2001

-04

Note 2 changed (Table 13: Absolute maximum ratings)

12-Mar-2002

-05

RFU pins must be left disconnected

Specification of PLCC32 package mechanical data revised

09-Jul-2004

6.0

Revision numbering modified.

Document imported in new template (and so reformatted).

Temperature Range ordering information replaced by Device Grade,

Standard packing option added and Plating Technology added to

Table 27: Ordering information scheme. TLEAD parameter added to

Table 13: Absolute maximum ratings and TBIAS parameter removed.

12-Jul-2004

7.0

Inches values corrected in Table 27: Ordering information scheme.

10-Nov-2004

8.0

TSOP32 package added. Figure 2: Logic diagram (A/A Mux Interface)

and Table 2: Signal names (A/A Mux interface) added.

24-Oct-2006

Document converted to new ST template.

Packages are ECOPACK® compliant. TLEAD removed from Table 13:

Absolute maximum ratings.

Device grade 1 removed. Blank Plating Technology option removed

from Table 27: Ordering information scheme.

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