NCP2809 Series

http://onsemi.com

4

PIN FUNCTION DESCRIPTION

Pin

Type

Symbol

Description

1

I

IN_R

Negative input of the second amplifier. It receives the audio input signal. Connected to the input

2

I

SHUTDOWN

The device enters in shutdown mode when a a low level is applied on this pin.

3

I

BYPASS

4

O

REF_I

Virtual ground amplifier feed back. This pin sets the stereo headset ground. In order to improve

crosstalk, this pin must be connected as close as possible to the ground connection of the headset

(ideally at the ground pin of the headset connector). When one uses bypassing capacitors, this pin

must be left unconnected.

5

I

IN_L

Negative input of the first amplifier. It receives the audio input signal. Connected to the input

6

O

OUT_L

Stereo headset amplifier analog output left. This pin will output the amplified analog signal and,

depending on the application, must be coupled with a capacitor or directly connected to the left

loudspeaker of the headset. This output is able to drive a 16

W load in a single−ended configuration.

7

I

Positive analog supply of the cell. Range: 2.2 V – 5.5 V

8

O

OUT_I

Virtual ground for stereo Headset common connection. This pin is directly connected to the

common connection of the headset when use of bypassing capacitor is not required. When one

uses bypassing capacitors, this pin must be left unconnected.

9

I

Analog Ground

10

O

OUT_R

Stereo headset amplifier analog output right. This pin will output the amplified analog signal and,

depending on the application, must be coupled with a capacitor or directly connected to the right

loudspeaker of the headset. This output is able to drive a 16

W load in a single−ended configuration.

Rating

Symbol

Value

Unit

Supply Voltage

6.0

V

Operating Supply Voltage

2.2 to 5.5

V

Input Voltage

V

Max Output Current

250

mA

Power Dissipation

Internally Limited

−

Operating Ambient Temperature

−40 to +85

°C

Max Junction Temperature

150

°C

Storage Temperature Range

−65 to +150

°C

Thermal Resistance, Junction−to−Air

200

°C/W

ESD Protection

Human Body Model (HBM) (Note 1)

Machine Model (MM) (Note 2)

−

8000

200

V

Latch up current at Ta = 85

_C (Note 3)

±100

mA

Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If stress

limits are exceeded device functional operation is not implied, damage may occur and reliability may be affected. Functional operation should be

restricted to the Recommended Operating Conditions.

1. Human Body Model, 100 pF discharged through a 1.5 k

W resistor following specification JESD22/A114 8.0 kV can be applied on OUT_L,

OUT_R, REF_I and OUT_I outputs. For other pins, 2.0 kV is the specified voltage.

2. Machine Model, 200 pF discharged through all pins following specification JESD22/A115.

3. Maximum ratings per JEDEC standard JESD78.

*This device contains 752 active transistors and 1740 MOS gates.