TSL2521 datasheet(72/81 Pages) OSRAM

72 / 81 page

Datasheet, Public

Page 71

[v3-00] 2022-Dec-21

Document Feedback

TSL2521 − Soldering & Storage Information

Soldering Information

The module has been tested and has demonstrated an ability

to be reflow soldered to a PCB substrate. The solder reflow

profile describes the expected maximum heat exposure of

components during the solder reflow process of product on a

PCB. Temperature is measured on top of component. The

components should be limited to a maximum of three passes

through this solder reflow profile.

Figure 91:

Solder Reflow Profile

Note(s):

1. Tolerance for peak profile temperature (TP) is defined as a supplier minimum and a user maximum.

Profile Feature Preheat/Soak

Sn-Pb Eutectic Assembly

Pb-Free Assembly

Temperature Min (Tsmin)

100°C

150°C

Temperature Max (Tsmax)

150°C

200°C

Time (ts) from (Tsmin to Tsmax)

60-120 seconds

Ramp-up rate (TL to TP)

3°C/second max.

Liquidous temperature (TL)

Time (tL) maintained above TL

183°C

60-150 seconds

217°C

60-150 seconds

Peak package body temperature (TP)

For users TP must not exceed the

Classification temp of 235°C

For suppliers TP must equal or

exceed the Classification temp

of 235°C

For users TP must not exceed the

Classification temp of 260°C

For suppliers TP must equal or

exceed the Classification temp of

260°C

Time (tP)

(1) within 5°C of the

specified classification temperature

(Tc)

20(1) seconds

30(1) seconds

Ramp-down rate (TP to TL)

6°C/second max.

Time 25°C to peak temperature

6 minutes max.

8 minutes max.

Soldering & Storage

Information

TSL2521 Arkusz danych(PDF) 72 Page - OSRAM GmbH

TSL2521 Arkusz danych(HTML) 72 Page - OSRAM GmbH

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81

Arkusz danych Pobierz

Link URL