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MSC8144 Arkusz danych(PDF) 28 Page - Freescale Semiconductor, Inc

Numer części MSC8144
Szczegółowy opis  Quad Core Digital Signal Processor
PDF  80 Pages
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Producent  FREESCALE [Freescale Semiconductor, Inc]
Strona internetowa  http://www.freescale.com
Logo FREESCALE - Freescale Semiconductor, Inc

MSC8144 Arkusz danych(HTML) 28 Page - Freescale Semiconductor, Inc

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MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 1
Electrical Characteristics
Freescale Semiconductor
28
2.4
Thermal Characteristics
Table 5 describes thermal characteristics of the MSC8144 for the FC-PBGA packages.
Section 3.5, Thermal Considerations provides a detailed explanation of these characteristics.
2.5
Power Characteristics
The estimated typical power dissipation for MSC8144 versus the core frequency is shown in Table 6.
Table 5. Thermal Characteristics for the MSC8144
Characteristic
Symbol
FC-PBGA
29
× 29 mm5
Unit
Natural
Convection
200 ft/min
(1 m/s) airflow
Junction-to-ambient1, 2
RθJA
20
15
°C/W
Junction-to-ambient, four-layer board1, 3
RθJA
15
12
°C/W
Junction-to-board (bottom)4
RθJB
7
°C/W
Junction-to-case5
RθJC
0.8
°C/W
Notes:
1.
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
2.
Per JEDEC JESD51-2 with the single layer board (JESD51-3) horizontal.
3.
Per JEDEC JESD51-6 with the board (JESD51-7) horizontal.
4.
Thermal resistance between the die and the printed circuit board per JEDEC JESD 51-8. Board temperature is measured on
the top surface of the board near the package.
5.
Thermal resistance between the active surface of the die and the case top surface determined by the cold plate method (MIL
SPEC-883 Method 1012.1) with the calculated case temperature.
Table 6. Power Dissipation
Extended Core Frequency
Core Frequency
Typical
Unit
266
400
TBD
W
533
TBD
667
TBD
800
TBD
333
500
TBD
W
667
TBD
833
TBD
1000
TBD
400
400
TBD
W
600
TBD
800
TBD
1000
TBD
500
500
TBD
W
750
TBD
1000
TBD
Note:
Measured for 1.0 V core at 25°C junction temperature.



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