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IS25LE512M-RMLA3:P-TY Arkusz danych(PDF) 105 Page - Integrated Silicon Solution, Inc

Numer części IS25LE512M-RMLA3:P-TY
Szczegółowy opis  SERIAL FLASH MEMORY 133/112MHZ MULTI I/O SPI & QUAD I/O QPI DTR INTERFACE WITH ON-CHIP ECC
PDF  189 Pages
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Producent  ISSI [Integrated Silicon Solution, Inc]
Strona internetowa  http://www.issi.com
Logo ISSI - Integrated Silicon Solution, Inc

IS25LE512M-RMLA3:P-TY Arkusz danych(HTML) 105 Page - Integrated Silicon Solution, Inc

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IS25LE512M
IS25WE512M
Integrated Silicon Solution, Inc.- www.issi.com
105
Rev. A6
06/16/2025
8.24 ENTER DEEP POWER DOWN (DP, B9h)
The Deep Power-down (DP) instruction is for setting the device on the minimizing the power consumption (enter
into Power-down mode). During this mode, standby current is reduced from Isb1 to Isb2. While in the Power-down
mode, the device is not active and all Write/Program/Erase instructions are ignored. The instruction is initiated by
driving the CE# pin low and shifting the instruction code into the device. The CE# pin must be driven high after the
instruction has been latched, or Power-down mode will not engage. Once CE# pin driven high, the Power-down
mode will be entered within the time duration of tDP. While in the Power-down mode only the Release from Power-
down/RDID instruction, which restores the device to normal operation, will be recognized. All other instructions are
ignored, including the Read Status Register instruction which is always available during normal operation. Ignoring
all but one instruction makes the Power Down state a useful condition for securing maximum write protection. It is
available in both SPI and QPI mode.
Figure 8.55 Enter Deep Power Down Mode Sequence In SPI Mode
Instruction = B9h
CE #
SCK
SI
0
1
2
3
4
5
6
7
Mode 3
Mode 0
tDP
SO
High Impedance
Figure 8.56 Enter Deep Power Down Mode Sequence In QPI Mode
B9h
CE#
SCK
IO[3:0]
0
1
Mode 3
Mode 0
tDP



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