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Networking Silicon — 82541(PI/GI/EI)

Contents

1.0

Introduction......................................................................................................................... 7

1.1

Document Scope................................................................................................... 7

1.2

Reference Documents........................................................................................... 8

1.3

Product Codes....................................................................................................... 8

2.0

Architectural Overview ..................................................................................................... 11

2.1

External Architecture Block Diagram................................................................... 11

2.2

Internal MAC Architecture Block Diagram........................................................... 12

2.3

Integrated 10/100/1000Mbps PHY ...................................................................... 12

2.4

System Interface ................................................................................................. 12

3.0

Signal Descriptions........................................................................................................... 11

3.1

Signal Type Definitions........................................................................................ 11

3.2

PCI Bus Interface Signals (56) ............................................................................11

3.2.1

PCI Address, Data and Control Signals (44) .......................................... 12

3.2.2

Arbitration Signals (2)............................................................................. 13

3.2.3

Interrupt Signal (1)..................................................................................13

3.2.4

System Signals (4) ................................................................................. 13

3.2.5

Error Reporting Signals (2).....................................................................14

3.2.6

Power Management Signals (3) ............................................................. 14

3.2.7

SMB Signals (3) ..................................................................................... 14

3.3

EEPROM and Serial FLASH Interface Signals (9).............................................. 15

3.4

Miscellaneous Signals.........................................................................................15

3.4.1

LED Signals (4) ...................................................................................... 15

3.4.2

Other Signals (4) .................................................................................... 16

3.5

PHY Signals ........................................................................................................ 16

3.5.1

Crystal Signals (2) ..................................................................................16

3.5.2

Analog Signals (10) ................................................................................ 16

3.6

Test Interface Signals (6) .................................................................................... 17

3.7

Power Supply Connections ................................................................................. 17

3.7.1

Digital and Analog Supplies ................................................................... 17

3.7.2

Grounds, Reserved Pins and No Connects ........................................... 18

3.7.3

Voltage Regulation Control Signals (2) ..................................................18

4.0

Voltage, Temperature, and Timing Specifications............................................................ 19

4.1

Absolute Maximum Ratings................................................................................. 19

4.2

Targeted Recommended Operating Conditions..................................................19

4.2.1

General Operating Conditions................................................................ 19

4.2.2

Voltage Ramp and Sequencing Recommendations...............................20

4.3

DC Specifications ................................................................................................ 22

4.4

AC Characteristics...............................................................................................25

4.5

Timing Specifications .......................................................................................... 27

5.0

Package and Pinout Information ...................................................................................... 33

5.1

Package Information ........................................................................................... 33

5.2

Thermal Specifications ........................................................................................ 35

5.3

Pinout Information ...............................................................................................36