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GD82541PI Arkusz danych(PDF) 34 Page - Intel Corporation |
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GD82541PI Arkusz danych(HTML) 34 Page - Intel Corporation |
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34 / 46 page ![]() 82541(PI/GI/EI) — Networking Silicon 34 Figure 12. 196 PBGA Package Pad Detail As illustrated in Figure 12, the Ethernet controller package uses solder mask defined pads. The copper area is 0.60 mm and the opening in the solder mask is 0.45 mm. The nominal ball sphere diameter is 0.50 mm. 0.45 Solder Resist Opening 0.60 Metal Diameter Detail Area |
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