| Zakładka z wyszukiwarką danych komponentów |
|
M24M02-DRMN6TP Arkusz danych(PDF) 32 Page - STMicroelectronics |
|
|
|||||||||||||||||||||||||||||
M24M02-DRMN6TP Arkusz danych(HTML) 32 Page - STMicroelectronics |
|
32 / 38 page ![]() Package mechanical data M24M02-DR 32/38 DocID18204 Rev 8 Figure 16. SO8N – 8-lead plastic small outline, 150 mils body width, package recommended footprint 1. Dimensions are expressed in millimeters. 9.2 WLCSP package information Figure 17. WLCSP- 8-bump, 3.556 x 2.011 mm, wafer level chip scale package outline 1. Drawing is not to scale. 2. Primary datum Z and seating plane are defined by the spherical crowns of the bump. |
|
Link URL |
| Czy Alldatasheet okazała się pomocna? [ DONATE ] |
O Alldatasheet | Reklama | Kontakt | Polityka prywatności | Link do karty katalogowej | Linki | Lista producentów All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |