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LTC4221IGN Arkusz danych(PDF) 23 Page - Linear Technology |
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LTC4221IGN Arkusz danych(HTML) 23 Page - Linear Technology |
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23 / 28 page ![]() 23 LTC4221 4221f the input supply line, exhibiting a peak overshoot to 2.5 times the steady-state value. This peak is followed by a damped sinusoidal response whose duration and period are dependent on the resonant circuit parameters. This can cause detrimental damage to board components unless measures are taken. The energy stored in the lead/trace inductance is easily controlled with snubbers and/or transient voltage sup- pressors. Even when ferrite beads are used for electro- magnetic interference (EMI) control, the low saturating current of ferrite will not pose a major problem if the transient voltage suppressors with adequate ratings are used. The transient associated with a GATE turn off can be controlled with a snubber and/or transient voltage sup- pressor. Snubbers such as RC networks are effective especially at low voltage supplies. The choice of RC is usually determined experimentally. The value of the snub- ber capacitor is usually chosen between 10 to 100 times the MOSFET COSS. The value of the snubber resistor is typically between 3Ω to 100Ω. When the supply exceeds 7V or EMI beads exist in the wire harness, a transient voltage suppressor and snubber are recommended to clip off large spikes and reduce the ringing. For supply volt- ages of 6V or below, a snubber network should be suffi- cient to protect against transient voltages. These protection networks should be mounted very close to each of LTC4221’s two supply voltages using short lead lengths to minimize lead inductance. This is shown schematically in the Typical Application on the front page of this data sheet. In many cases, a simple short-circuit test can be per- formed to determine the need of the transient voltage suppressor. Additional overvoltage protection is provided by the FB n pins. APPLICATIO S I FOR ATIO PCB Layout Considerations A recommended layout for the SENSE resistors, the power MOSFETs, VCC transient protection devices and GATE drive components around the LTC4221 is shown in Figure 16. For proper operation of the LTC4221’s elec- tronic circuit breaker, a 4-wire Kelvin connection to each SENSE resistor is used. Also, PCB layout for the external N-channel MOSFETs emphasizes optimal thermal man- agement of MOSFET power dissipation to keep θJA as low as possible. The VCC transient protection devices are positioned close to the supply pins to reduce lead induc- tance and thus overshoot voltage. In Hot Swap applications where load currents can reach 10A or more, PCB track width must be appropriately sized to keep track resistance and temperature rise to a mini- mum. Consult Appendix A of LTC Application Note 69 for details on sizing and calculating trace resistances as a function of copper thickness. In the majority of applications, it will be necessary to use plated-through vias to make circuit connections from component layers to power and ground layers internal to the PC board. For 1oz copper foil plating, a good starting point is 1A of DC current per via, making sure the via is properly dimensioned so that solder completely fills any void. For other plating thicknesses, check with your PCB fabrication facility. |
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