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MPC755 Arkusz danych(PDF) 33 Page - Motorola, Inc |
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MPC755 Arkusz danych(HTML) 33 Page - Motorola, Inc |
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33 / 56 page ![]() MPC755 RISC Microprocessor Hardware Specifications, Rev. 6.1 Freescale Semiconductor 33 Package Description 7.3 Package Parameters for the MPC755 CBGA The package parameters are as provided in the following list. The package type is 25 × 25 mm, 360-lead ceramic ball grid array (CBGA). Package outline 25 × 25 mm Interconnects 360 (19 × 19 ball array – 1) Pitch 1.27 mm (50 mil) Minimum module height 2.65 mm Maximum module height 3.20 mm Ball diameter 0.89 mm (35 mil) |
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