MPC755 datasheet(10/56 Pages) MOTOROLA

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MPC755 RISC Microprocessor Hardware Specifications, Rev. 6.1

Freescale Semiconductor

Electrical and Thermal Characteristics

The MPC755 incorporates a thermal management assist unit (TAU) composed of a thermal sensor, digital-to-analog

converter, comparator, control logic, and dedicated special-purpose registers (SPRs). See the MPC750 RISC

Microprocessor Family User’s Manual for more information on the use of this feature. Specifications for the thermal

sensor portion of the TAU are found in Table 5.

Table 4. Package Thermal Characteristics 6

Characteristic

Symbol

Value

Unit

Notes

MPC755

CBGA

MPC755

PBGA

MPC745

PBGA

Junction-to-ambient thermal resistance, natural

convection

RθJA

°C/W

1, 2

Junction-to-ambient thermal resistance, natural

convection, four-layer (2s2p) board

RθJMA

°C/W

1, 3

Junction-to-ambient thermal resistance, 200 ft/min

airflow, single-layer (1s) board

RθJMA

°C/W

1, 3

Junction-to-ambient thermal resistance, 200 ft/min

airflow, four-layer (2s2p) board

RθJMA

°C/W

1, 3

Junction-to-board thermal resistance

RθJB

817

°C/W

Junction-to-case thermal resistance

RθJC

<0.1

°C/W

Notes:

1. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient

temperature, air flow, power dissipation of other components on the board, and board thermal resistance.

2. Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.

3. Per JEDEC JESD51-6 with the board horizontal.

4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top surface

of the board near the package.

5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method 1012.1) with

the calculated case temperature. The actual value of RθJC for the part is less than 0.1°C/W.

6. Refer to Section 8.8, “Thermal Management Information,” for more details about thermal management.

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