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MM04C20R0FTL Arkusz danych(PDF) 5 Page - WALSIN TECHNOLOGY CORPORATION |
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MM04C20R0FTL Arkusz danych(HTML) 5 Page - WALSIN TECHNOLOGY CORPORATION |
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5 / 11 page ![]() Approval sheet Page 5 of 11 ASC_MMxxB&C AUG - 2018 SOLDERING CONDITION The robust construction of cylindrical resistors allows them to be completely immersed in a solder bath of 260 °C for 10 seconds. Therefore, it is possible to mount Surface Mount Resistors on one side of a PCB and other discrete components on the reverse (mixed PCBs). Surface Mount Resistors are tested for solderability at 235 °C during 2 seconds within lead-free solder bath. The test condition for no leaching is 260 °C for 30 seconds. Typical examples of soldering profile and condition that provide reliable joints without any damage are given in Fig 3. and Table 1. Fig. 3 Infrared soldering profile for MELF Resistors Table 1. Infrared soldering condition for MELF Resistors Temperature Condition Exposure Time Average ramp-up rate (217 °C to 260°C) Less than 3 °C/second Between 150 and 200 °C Between 60-120 seconds > 217 °C Between 60-150 seconds Peak Temperature 260ºC +0/-5 °C Time within 245 °C Min. 30 seconds Ramp-down rate (Peak to 217 °C) Less than 6 °C/second Time from 25 °C to Peak No greater than 480 seconds For Ni/Sn series soldering |
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