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STM8S103F2 Arkusz danych(PDF) 101 Page - STMicroelectronics |
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STM8S103F2 Arkusz danych(HTML) 101 Page - STMicroelectronics |
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101 / 121 page ![]() DocID15441 Rev 14 101/121 STM8S103F2 STM8S103F3 STM8S103K3 Package information 107 Figure 57. TSSOP20 recommended package footprint 1. Dimensions are expressed in millimeters. 3. Dimension “E1” does not include interlead flash or protrusions. Interlead flash or protrusions shall not exceed 0.25mm per side. |
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