DATA SHEET • SKY73208-11: MIXER WITH PLL AND VCO

Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com

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November 5, 2015 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 201317F

Evaluation Board Description

The SKY73208-11 Evaluation Board is used to test the

performance of the SKY73208-11 module. An Evaluation Board

schematic diagram is provided in Figure 8. An assembly drawing

for the Evaluation Board is shown in Figure 9 and the layer detail

is provided in Figure 10.

Circuit Design Configurations

The following design considerations are general in nature and

must be followed regardless of final use or configuration:

 Paths to ground should be made as short as possible.

 The ground pad of the SKY73208-11 has special electrical and

thermal grounding requirements. This pad is the main thermal

conduit for heat dissipation. Since the circuit board acts as the

heat sink, it must shunt as much heat as possible from the

device. Therefore, design the connection to the ground pad to

dissipate the maximum wattage produced by the circuit board.

 Skyworks recommends including external bypass capacitors on

Package Dimensions

The PCB layout footprint for the SKY73208-11 is provided in

Figure 11. Figure 12 shows the package dimensions, and

Figure 13 provides the tape and reel dimensions.

Package and Handling Information

Since the device package is sensitive to moisture absorption, it is

baked and vacuum packed before shipping. Instructions on the

shipping container label regarding exposure to moisture after the

container seal is broken must be followed. Otherwise, problems

related to moisture absorption may occur when the part is

subjected to high temperature during solder assembly.

The SKY73208-11 is rated to Moisture Sensitivity Level 3 (MSL3)

at 260

C. It can be used for lead or lead-free soldering. For

additional information, refer to the Skyworks Application Note,

PCB Design & SMT Assembly/Rework Guidelines for MCM-L

Packages, document number 101752.

Care must be taken when attaching this product, whether it is

done manually or in a production solder reflow environment.

Production quantities of this product are shipped in a standard

tape and reel format.