DATA SHEET • SKY73208-11: MIXER WITH PLL AND VCO

Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com

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November 5, 2015 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 201317F

S2106

Stencil Aperture

Top View

Metallization

Top View

Solder Mask Opening

Top View

6.3

6.3

36X 0.25

9X 0.875

6.3

6.3

6.4

6.4

36X 0.35

2X 1.4375

2X 1.4375

0.125 Typ.

0.5 Pitch

Pin 36

Pin 1

Pin 1 Indicator

0.2 X 0.2

9X 0.875

36X 0.75

0.6 Pitch

Stencil aperture size of 80% to

100% of the module/package

solder mask openings.

Opening size of 60% to

100% of exposed center

opening shown.

Component Outline

Exposed Center Pad

All measurements are in millimeters

34X 0.75

0.5 Pitch

Pin 36

Pin 1 Indicator

0.2 X 0.2

Pin 1

Pin 36

Pin 1

Component Outline

Component Outline

0.5 Pitch

36X 0.85

34X 0.25

0.6 Pitch

0.25 Typ.

Thermal via array ø0.3 mm on

0.6 mm pitch will improve

thermal performance.

NOTE: thermal vias should be resin-

filled and capped according to

IPC-4761 Type VII vias. 30-35

μm

Cu thickness recommended.

Figure 11. SKY73208-11 PCB Layout Footprint