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MPC8280 Arkusz danych(PDF) 55 Page - Freescale Semiconductor, Inc

Numer części MPC8280
Szczegółowy opis  PowerQUICC??II Family Reference Manual
PDF  1386 Pages
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Producent  FREESCALE [Freescale Semiconductor, Inc]
Strona internetowa  http://www.freescale.com
Logo FREESCALE - Freescale Semiconductor, Inc

MPC8280 Arkusz danych(HTML) 55 Page - Freescale Semiconductor, Inc

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MPC8280 PowerQUICC II Family Reference Manual, Rev. 1
Freescale Semiconductor
lv
Figures
Figure
Number
Title
Page
Number
11-61
RAM Array and Signal Generation .................................................................................... 11-71
11-62
The RAM Word................................................................................................................... 11-71
11-63
CS Signal Selection............................................................................................................. 11-76
11-64
BS Signal Selection............................................................................................................. 11-76
11-65
UPM Read Access Data Sampling...................................................................................... 11-79
11-66
Wait Mechanism Timing for Internal and External Synchronous Masters ......................... 11-80
11-67
DRAM Interface Connection to the 60x Bus (64-Bit Port Size) ........................................ 11-82
11-68
Single-Beat Read Access to FPM DRAM .......................................................................... 11-84
11-69
Single-Beat Write Access to FPM DRAM ......................................................................... 11-85
11-70
Burst Read Access to FPM DRAM (No LOOP) ................................................................ 11-86
11-71
Burst Read Access to FPM DRAM (LOOP) ...................................................................... 11-87
11-72
Burst Write Access to FPM DRAM (No LOOP)................................................................ 11-88
11-73
Refresh Cycle (CBR) to FPM DRAM ................................................................................ 11-89
11-74
Exception Cycle .................................................................................................................. 11-90
11-75
FPM DRAM Burst Read Access (Data Sampling on Falling Edge of CLKIN)................. 11-92
11-76
MPC8280/EDO Interface Connection to the 60x Bus ........................................................ 11-93
11-77
Single-Beat Read Access to EDO DRAM .......................................................................... 11-94
11-78
Single-Beat Write Access to EDO DRAM ......................................................................... 11-95
11-79
Single-Beat Write Access to EDO DRAM Using REDO to Insert Three
Wait States ...................................................................................................................... 11-96
11-80
Burst Read Access to EDO DRAM .................................................................................... 11-97
11-81
Burst Write Access to EDO DRAM ................................................................................... 11-98
11-82
Refresh Cycle (CBR) to EDO DRAM ................................................................................ 11-99
11-83
Exception Cycle For EDO DRAM ................................................................................... 11-100
11-84
Pipelined Bus Operation and Memory Access in 60x-Compatible Mode ........................ 11-104
11-85
External Master Access (GPCM)...................................................................................... 11-105
11-86
External Master Configuration with SDRAM Device ...................................................... 11-106
12-1
L2 Cache in Copy-Back Mode.............................................................................................. 12-2
12-2
External L2 Cache in Write-Through Mode ......................................................................... 12-4
12-3
External L2 Cache in ECC/Parity Mode............................................................................... 12-6
12-4
Read Access with L2 Cache.................................................................................................. 12-8
13-1
Test Logic Block Diagram .................................................................................................... 13-2
13-2
TAP Controller State Machine .............................................................................................. 13-3
13-3
Output Pin Cell (O.Pin)......................................................................................................... 13-4
13-4
Observe-Only Input Pin Cell (I.Obs) .................................................................................... 13-4
13-5
Output Control Cell (IO.CTL) .............................................................................................. 13-5
13-6
General Arrangement of Bidirectional Pin Cells .................................................................. 13-5
14-1
CPM Block Diagram............................................................................................................. 14-3
14-2
Communications Processor (CP) Block Diagram................................................................. 14-6
14-3
RISC Controller Configuration Register (RCCR.................................................................. 14-9
14-4
RISC Time-Stamp Control Register (RTSCR) ................................................................... 14-11



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