FDC2114 datasheet(5/61 Pages) TI1

5 / 61 page

FDC2212, FDC2214, FDC2112, FDC2114

www.ti.com

SNOSCZ5A – JUNE 2015 – REVISED JUNE 2015

Pin Functions (continued)

TYPE(1)

DESCRIPTION

NAME

NO.

IN3A

Capacitive sensor input 3 (FDC2114 / FDC2214 only)

IN3B

Capacitive sensor input 3 (FDC2114 / FDC2214 only)

DAP(2)

DAP

N/A

Connect to Ground

(2)

There is an internal electrical connection between the exposed Die Attach Pad (DAP) and the GND pin of the device. Although the DAP

can be left floating, for best performance the DAP should be connected to the same potential as the device's GND pin. Do not use the

DAP as the primary ground for the device. The device GND pin must always be connected to ground.

8 Specifications

8.1 Absolute Maximum Ratings

MIN

MAX

UNIT

VDD

Supply voltage range

Voltage on any pin

–0.3

VDD + 0.3

Input current on any INx pin

–8

Input current on any digital pin

–5

Junction temperature

–55

150

°C

Tstg

Storage temperature

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

8.2 ESD Ratings

VALUE

UNIT

FDC2112 / FDC2212 in 12-pin WSON package

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V(ESD)

Electrostatic discharge

Charged-device model (CDM), per JEDEC specification JESD22-

±750

C101(2)

FDC2114 / FDC2214 in 16-pin WQFN package

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)

±2000

V(ESD)

Electrostatic discharge

Charged-device model (CDM), per JEDEC specification JESD22-

±750

C101(2)

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

8.3 Recommended Operating Conditions

Unless otherwise specified, all limits ensured for TA = 25°C, VDD = 3.3 V

MIN

NOM

MAX

UNIT

VDD

Supply voltage

2.7

3.6

Operating temperature

–40

125

°C

8.4 Thermal Information

FDC2112 /

FDC2214 /

FDC2212

FDC2214

THERMAL METRIC(1)

UNIT

DNT (WSON)

RGH (WQFN)

12 PINS

16 PINS

RθJA

Junction-to-ambient thermal resistance

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

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Product Folder Links: FDC2212 FDC2214 FDC2112 FDC2114

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