AD6676EBZ datasheet(58/90 Pages) AD

58 / 90 page

AD6676

Data Sheet

Rev. D | Page 58 of 90



All critical passive components, such as dc blocking and

power supply decoupling capacitors, are 0201 size and placed

on top side of the PCB. Two 0201 decoupling capacitors

(0.001 μF and 0.1 μF) are placed adjacent to supply pins

with the lower value placed closer to the AD6676.



The analog 1.1 V supply pins of the AD6676 share a common

1.1 V supply domain and are tied together below the device.



VSS2OUT (Pin G7) must be connected to VSS2IN (Pin F6)

on the top side layer of the PCB.



The alternative layout shown in Figure 141 uses 0.2 mm

through-hole vias just outside of the AD6676 package for

all supply and ground domains with all of the 1.1 V analog

supply domains (VDD1, VDDL, VDDC, and VDDQ)

connected to each other providing a low impedance path to

the critical inner VDD1 and VDDL balls. This alternative

layout also avoids any narrow signal traces to inner row balls

(with exception of CSB) by using a 3-wire SPI interface (with

the SDIO, RESETB, AGC4, and AGC3 balls left open).

Note that the thin inner trace for CSB (positioned between

the SCLK and SYNCINB− balls) could have been avoided

by running a wider straight trace instead of connecting the

CSB and SYNCINB− balls because, by default, the SYNCINB

input is configured for a CMOS input with only SYNCINB+

used for signaling (and SYNCINB− ignored).

Figure 140. AD6676EBZ PCB Top Side Layout Example

Figure 141. Alternative PCB Top Side Layout Example That Avoids a Through

Hole Via under the Device

Additional information specifically pertaining to the WLCSP

package considerations is contained in the AN-617 Application

Note. This application note covers PCB design guidelines,

assembly, reliability, and rework in detail.

AD6676EBZ Arkusz danych(PDF) 58 Page - Analog Devices