Ordering Information

MSC8112 Dual Core Digital Signal Processor Data Sheet, Rev. 0

Freescale Semiconductor

41

4

Ordering Information

Consult a Freescale Semiconductor sales office or authorized distributor to determine product availability and place an order.

5

Package Information

Part

Package Type

Core

Voltage

Operating

Temperature

Core

Frequency

(MHz)

Order Number

Lead-Free

Lead-Bearing

MSC8112

Flip Chip Plastic Ball Grid Array (FC-PBGA)

1.1 V

–40° to 105°C

300

MSC8112TVT2400V

MSC8112TMP2400V

Figure 35. MSC8112 Mechanical Information, 431-pin FC-PBGA Package

Notes:

1. All dimensions in millimeters.

2. Dimensioning and tolerancing

per ASME Y14.5M–1994.

3. Features are symmetrical about

the package center lines unless

dimensioned otherwise.

4. Maximum solder ball diameter

measured parallel to Datum A.

5. Datum A, the seating plane, is

determined by the spherical

crowns of the solder balls.

6. Parallelism measurement shall

exclude any effect of mark on

top surface of package.

7. Capacitors may not be present

on all devices.

8. Caution must be taken not to

short capacitors or exposed

metal capacitor pads on

package top.

9. FC CBGA (Ceramic) package

code: 5238.

FC PBGA (Plastic) package

code: 5263.

10.Pin 1 indicator can be in the

form of number 1 marking or an

“L” shape marking.