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MSC8112 Arkusz danych(PDF) 13 Page - Freescale Semiconductor, Inc |
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MSC8112 Arkusz danych(HTML) 13 Page - Freescale Semiconductor, Inc |
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13 / 44 page ![]() Electrical Characteristics MSC8112 Dual Core Digital Signal Processor Data Sheet, Rev. 0 Freescale Semiconductor 13 2 Electrical Characteristics This document contains detailed information on power considerations, DC/AC electrical characteristics, and AC timing specifications. For additional information, see the MSC8112 Reference Manual. 2.1 Maximum Ratings In calculating timing requirements, adding a maximum value of one specification to a minimum value of another specification does not yield a reasonable sum. A maximum specification is calculated using a worst case variation of process parameter values in one direction. The minimum specification is calculated using the worst case for the same parameters in the opposite direction. Therefore, a “maximum” value for a specification never occurs in the same device with a “minimum” value for another specification; adding a maximum to a minimum represents a condition that can never exist. Table 2 describes the maximum electrical ratings for the MSC8112. CAUTION This device contains circuitry protecting against damage due to high static voltage or electrical fields; however, normal precautions should be taken to avoid exceeding maximum voltage ratings. Reliability is enhanced if unused inputs are tied to an appropriate logic voltage level (for example, either GND or VDD). Table 2. Absolute Maximum Ratings Rating Symbol Value Unit Core and PLL supply voltage VDD –0.2 to 1.6 V I/O supply voltage VDDH –0.2 to 4.0 V Input voltage VIN –0.2 to 4.0 V Maximum operating temperature: TJ 105 °C Minimum operating temperature TJ –40 °C Storage temperature range TSTG –55 to +150 °C Notes: 1. Functional operating conditions are given in Table 3. 2. Absolute maximum ratings are stress ratings only, and functional operation at the maximum is not guaranteed. Stress beyond the listed limits may affect device reliability or cause permanent damage. 3. Section 4.5, Thermal Considerations includes a formula for computing the chip junction temperature (TJ). |
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